LITE TKBN25
semi-crystalline
Properties
Semi-crystalline thermoplastic PEEK film filled with up to 25 % boron nitride
General properties:
General properties:
- higher thermal conductivity
- lower coefficient of thermal expansion
- Density (ISO1183): 1,44 g/cm³
- Glass transition temperature (ISO11357): 143 °C
- Melting temperature: 343 °C
- Tensile strength at 23°C (ISO527): 90 N/mm²
- Tensile elongation at 23°C (ISO527): 3,9 %
- Tensile modulus (ISO527): - N/mm²
- Coefficient of thermal expansion. x10³ (T<Tg)(internal): - 1/°K
- Thermal conductivity x 10²: approx. 60 W/mK
Typical applications
- electrically insulating and thermal conductive films
- substrates for sensors