LITE TKBN25
Properties
Semi-crystalline thermoplastic PEEK film filled with up to 25 % boron nitride

General properties:
  • higher thermal conductivity
  • lower coefficient of thermal expansion
Physical properties:
  • Density (ISO1183): 1,3 g/cm³
  • Glass transition temperature (ISO11357): 143 °C
  • Melting temperature: 343 °C
Mechanical properties: (sample thickness 50 µm)
  • Tensile strength at 23°C (ISO527): 130 N/mm²
  • Tensile elongation at 23°C (ISO527): 170 %
  • Tensile modulus (ISO527): 3200 N/mm²
Electrical properties:
  • Dielectric strength (IEC243): 180 kV/mm
Thermal properties:
  • Thermal conductivity x 10² (ASTM E1461-13): approx. 50 W/mK

Typical applications

  • electrically insulating and thermal conductive films
  • substrates for sensors